2023 Schedule

Thermal Management
March 15
Controlling the thermal environment of electronic systems involves cooling heat-generating electronics and dissipating heat away from other components and systems. Tutorials will address how to overcome thermal management challenges in systems and devices from EVs to wide bandgap semiconductors and more.
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Designing for Sustainability
June 28
With electrification comes the responsibility to discover and implement improved and innovative ways to reach sustainability. Learn how to design for low-power, sustainably manufactured components, disposal, software for minimal energy use, and minimal energy/materials used in manufacturing.
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Battery Management
August 9
Sessions will cover the challenges and solutions around increasing capacity and voltage for high efficiency, battery circuit design for charging and management, battery modes and strategies for reducing energy consumption, test and measurement for safety, designing with Li-ion, powertrain BMS for EVs, and more.
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Motor Drives Design
September 13-14
Challenges and solutions to noise and vibration in linear and stepper motors, generating PWM waveforms, motor power testing, optimizing EV inverter designs and body motor systems in vehicles, and wide bandgap switching for greater power densities and better efficiency.
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IoT Design/Wireless
October 11
IoT design includes interfacing MCUs to sensors, wireless ICs, modules, and wired/wireless networks. Issues surrounding energy consumption, security, firmware software make designs ever more difficult. These sessions will discuss best design/test practices to bring connected devices to market.
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Electric Vehicle Design
November 8-9
Drive your EV design challenge with solutions covering connectivity, LiDAR/radar, offboard charging, safety and security, Ethernet, and the complete powertrain from the onboard charger, battery pack, BMS, traction inverter, motor controller, dc-dc converters, to high-power connectors.
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5G/RF Design
December 6
RF, microwave, and mmWave systems depend on components to transmit and receive signals. On the wired side, signal and power integrity issues can cause errors in buses such as PCIe and USB. Sessions will look at best design and test practices that minimize data errors on the board and over the air.
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