Sessions
Speaker: Theodore S. Rappaport, David Lee/Ernst Weber Professor, New York University
Future wireless cellular networks will utilize millimeter wave and sub-THz frequencies and deploy small-cell base stations to achieve data rates on the order of hundreds of Gigabits per second per user. The move to sub-THz frequencies will require attention to sustainability and reduction of power whenever possible to reduce the carbon footprint while maintaining adequate battery life for the massive number of resource constrained devices to be deployed. This article analyzes power consumption of future wireless networks using a new metric, the power waste factor (W), which shows promise for the study and development of “green G” - green technology for future wireless networks.
Using W, power efficiency can be considered by quantifying the power wasted by all devices on a signal path ina cascade. We then show that the consumption efficiency factor (CEF), defined as the ratio of the maximum data rate achieved to the total power consumed, is a novel and powerful measure of power efficiency that shows less energy per bit is expended as the cell size shrinks and carrier frequency and channel bandwidth increase. Our findings offer a standard approach to calculating and comparing power consumption and energy efficiency in cascaded systems. Finally, we postulate this framework could be applied to other aspects of power efficiency metrics for data centers, algorithmic design, and software design.
Future wireless cellular networks will utilize millimeter wave and sub-THz frequencies and deploy small-cell base stations to achieve data rates on the order of hundreds of Gigabits per second per user. The move to sub-THz frequencies will require attention to sustainability and reduction of power whenever possible to reduce the carbon footprint while maintaining adequate battery life for the massive number of resource constrained devices to be deployed. This article analyzes power consumption of future wireless networks using a new metric, the power waste factor (W), which shows promise for the study and development of “green G” - green technology for future wireless networks.
Using W, power efficiency can be considered by quantifying the power wasted by all devices on a signal path ina cascade. We then show that the consumption efficiency factor (CEF), defined as the ratio of the maximum data rate achieved to the total power consumed, is a novel and powerful measure of power efficiency that shows less energy per bit is expended as the cell size shrinks and carrier frequency and channel bandwidth increase. Our findings offer a standard approach to calculating and comparing power consumption and energy efficiency in cascaded systems. Finally, we postulate this framework could be applied to other aspects of power efficiency metrics for data centers, algorithmic design, and software design.
Speaker: Daniel Olis, Product marketing engineer, Texas Instruments
According to the Bluetooth® SIG, 35% of all IoT-connected devices rely on Bluetooth technology today and Bluetooth Low Energy single-mode devices are expected to triple between now and 2026. To meet this market demand, engineers are finding new ways to integrate Bluetooth technology to a wide array of applications such as medical devices, toys, personal electronics, smart home devices and more. And until now, they have had to face certain trade-offs, such as sacrificing RF performance and quality due to cost limitations. In this session, you will learn how TI’s new SimpleLink™ CC2340 wireless MCU family enables engineers to quickly and easily add quality and affordable Bluetooth LE to any application. These new wireless MCUs offer high-quality RF and power performance at half the price of competing devices.
According to the Bluetooth® SIG, 35% of all IoT-connected devices rely on Bluetooth technology today and Bluetooth Low Energy single-mode devices are expected to triple between now and 2026. To meet this market demand, engineers are finding new ways to integrate Bluetooth technology to a wide array of applications such as medical devices, toys, personal electronics, smart home devices and more. And until now, they have had to face certain trade-offs, such as sacrificing RF performance and quality due to cost limitations. In this session, you will learn how TI’s new SimpleLink™ CC2340 wireless MCU family enables engineers to quickly and easily add quality and affordable Bluetooth LE to any application. These new wireless MCUs offer high-quality RF and power performance at half the price of competing devices.
Speaker: Philip Belleau, Senior Product Manager, Handheld Analyzers, Anritsu Company
In this session, we will cover the best practices for using coaxial adapters during the calibration process in the field. Explore the impact of adding coaxial adapters post-calibration, the differences in quality and accuracy between adapters, and the resulting impact on the measurement(s) of the device under test (DUT). This session is primarily aimed at the cellular contractors and technicians that are responsible for the installation and maintenance of cellular base stations.
In this session, we will cover the best practices for using coaxial adapters during the calibration process in the field. Explore the impact of adding coaxial adapters post-calibration, the differences in quality and accuracy between adapters, and the resulting impact on the measurement(s) of the device under test (DUT). This session is primarily aimed at the cellular contractors and technicians that are responsible for the installation and maintenance of cellular base stations.
Dr. Gent Paparisto, Product Engineering Architect, Cadence
Learn about a new approach developed by Rhode & Schwarz in cooperation with Cadence to streamline the development process of RF components and systems by allowing real-world signals to be used in EDA system simulation and hardware tests. Simulation with complex wideband signals according to latest 5G new radio (NR) or Wi-Fi specifications enables more realistic results than before. Using the same signal creation methods and analysis algorithms as for subsequent hardware tests ensures a direct correlation from early design to implementation verification. This presentation is intended for engineers who design RF components and systems using tools for simulation and hardware test.
Learn about a new approach developed by Rhode & Schwarz in cooperation with Cadence to streamline the development process of RF components and systems by allowing real-world signals to be used in EDA system simulation and hardware tests. Simulation with complex wideband signals according to latest 5G new radio (NR) or Wi-Fi specifications enables more realistic results than before. Using the same signal creation methods and analysis algorithms as for subsequent hardware tests ensures a direct correlation from early design to implementation verification. This presentation is intended for engineers who design RF components and systems using tools for simulation and hardware test.
Speaker: Charles Cohen, President, Fotofab
Having a part design is one thing, having a part that is designed for manufacturability is another. Join us for a discussion on how to best design RF and EMI shielding so that it is ready for production. We will go over different types of shielding, the basics of what is needed on a print, tips for manipulating metal, manufacturing methods to achieve standard or custom shielding, and metal finishing options to make your part complete.
We all know products are getting smaller, meaning space is limited when it comes to hardware applications. Metal fabricators are able to pair a decades-old manufacturing method (photochemical machining) with state-of-the-art digital technology to create precise shielding in exact dimensional requirements. Iterations and prototyping are easy and the transition to full-scale production volumes can be easy with the right design in mind.
Having a part design is one thing, having a part that is designed for manufacturability is another. Join us for a discussion on how to best design RF and EMI shielding so that it is ready for production. We will go over different types of shielding, the basics of what is needed on a print, tips for manipulating metal, manufacturing methods to achieve standard or custom shielding, and metal finishing options to make your part complete.
We all know products are getting smaller, meaning space is limited when it comes to hardware applications. Metal fabricators are able to pair a decades-old manufacturing method (photochemical machining) with state-of-the-art digital technology to create precise shielding in exact dimensional requirements. Iterations and prototyping are easy and the transition to full-scale production volumes can be easy with the right design in mind.